DOUBLE SIDE – TECHANICAL SPECIFICATIONS
| Product Characteristics | Standard |
|---|
| Product Raw Material | FR4 |
| Board Thickness (in mm) | 0.4 , 0.8 ,1.0 , 1.2, 1.6 ,2.4 , 3.2 |
| Product Finish | HASL, TIN , Electroplated Gold & Nickel |
| Solder Mask Finish | PISM, Liquid Solder Mask |
| Solder Mask color | Green, White, Black, Blue ,Red |
| Legend/Ident color | White, Black |
| Special Requirement | Carbon Printing on Push Button , Electrolytic Gold, Electroless Gold/Nickle, Electro Plat Tin, Immersion Silver/Tin, OSP |
| Minimum conductor width | 0.15 mm |
| Minimum conductor Spacing/Air gap | 0.15 mm |
| Min. finished via pad size | 0.3 mm |
| Min. solder mask web width between pads | 0.15 mm |
| Minimum Plated hole size | 0.35 mm |
| Min. slot size for PTH slots (Tool size) | 0.8 mm |
| Minimum Plated hole to hole clearance | 0.3 mm |
| Copper Clearance from PCB Edge for scoring | 0.3 mm |
| Copper Clearance from PCB Edge for routing | 0.3 mm |
| Legend line width | 0.25 mm |
| Blind & Buried vias manufacturable | YES |
| Min. router size | 0.8 mm |
| SMT testing | 0.127 mm |
| Maximum laminate thickness | 3.2 mm |
| Minimum copper thickness | 1 Oz (35 microns) |
| Maximum copper thickness | 3 Oz (105 microns) |
| Maximum board size | 400 mm X 500 mm |
| Dedicated Electrical Testing | BBT, FPT & QC |
| PCB Cutting options | Routing & V groove |